Machining for the semiconductor industry
Modern electronics are becoming increasingly smaller and faster. The calculating power of smart phones, laptops, tablets and all kinds of embedded software is taking us to dizzy heights.
To achieve this speed and capacity chips are getting more complex and smaller. Whereas a few years ago, 50 nanometres was regarded as an ambitious minimum, these days, work is already being done on chips with 25 nanometre technology.
In the field of chips, the ‘nanometre hunt’ is being led by the Dutch company ASML, the producer of the lion’s share of the machines with which wafers are ‘printed’. (Wafers are thin slices of semiconductor material used in the fabrication of individual chips.) They serve a global market, with customers such as Intel, AMD and Samsung.
The demands on machining
Every part of these chip machines must meet the highest quality requirements. And this is where Landes comes into its own. Via first tier suppliers we supply customer-specific components for these machines.
Several criteria play a role during production:
- Accuracy: Landes works to micrometre accuracy
- Quality assurance
- Clean-room conditions to avoid contamination
- Flexibility: which we are renown for
- CNC milling aluminium, titanium and High Alloy Steels.
In short, Landes is a machining company which meets the demands of the semiconductor industry perfectly.